Product category:
Standard Logic Devices
News Release from: NXP Semiconductors | Subject: DQFN-packaged BiCMOS logic
Edited by the Electronicstalk Editorial
Team on 16 December 2004
BiCMOS logic shrinks into DQFN packages
Philips has unveiled the industry's smallest BiCMOS logic device in the depopulated very-thin quad flat-pack no-leads (DQFN) package.
In a drive to meet market demands for smaller electronic products, Philips has unveiled the industry's smallest BiCMOS logic device in the depopulated very-thin quad flat-pack no-leads (DQFN) package With DQFN packaging, Philips is able to offer the same performance characteristics of today's larger BiCMOS logic devices in a package that is 35% smaller, as well as a solid roadmap to continue cost reductions
This article was originally published on Electronicstalk on 23 Oct 2001 at 8.00am (UK)
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Ideal for space-constrained, performance-hungry applications such as networking and telecommunications equipment, set-top box solutions and many other computing appliances, Philips' BiCMOS logic devices in DQFN packaging will enable designers to further shrink circuit boards or free board space for additional components and functionality.
"This is the smallest packaging technology available in the market today for BiCMOS logic", said Bruce Potvin, Director of Marketing for Philips Semiconductors' Logic Products Group.
"DQFN packaging offers customers a roadmap to greater cost savings and design flexibility without sacrificing performance".
Continuing the tradition of being first to the market with logic devices using advanced packaging technology, Philips' DQFN-packaged BiCMOS logic devices are designed for logic gates and octals.
The devices incorporate an exposed die paddle, providing a 20% improvement in heat dissipation over a comparable TSSOP package.
The DQFN package is lead-free and eliminates assembly problems related to coplanarity and bent-lead issues.
Its package inductance is 60% less than in TSSOP, capacitance is 30% less, and package performance is up to 20% better due to the shorter wire length and internal traces.
The DQFN package is designed for inline pinouts, which makes new board design (or conversion from TSSOP) easier and less expensive.
Philips' 74LVT125 BQ and 74LVT126 BQ BiCMOS standard logic devices in DQFN packaging are available now.
These devices come in a 2.4 x 3mm footprint for a 14-pin configuration and are also available in 16-, 20- and 24-pin options.
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