Product category:
Communications ICs (Wireless)
News Release from: NXP Semiconductors | Subject: SmartMX
Edited by the Electronicstalk Editorial
Team on 03 November 2006
Contactless smartcard chips slim to 75um
NXP Semiconductors is the first volume supplier of ultrathin smart card ICs that are finer than a human hair, or a sheet of paper.
NXP Semiconductors is the first volume supplier of ultrathin smart card ICs that are finer than a human hair, or a sheet of paper The chips of NXP's proven SmartMX family can now be manufactured to be only 75um thick, which is 50% thinner than the current industry standard for smart card ICs
This article was originally published on Electronicstalk on 25 Oct 2001 at 8.00am (UK)
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High-security chip set for US passports
NXP's SmartMX passport chip solutions meet the ICAO BAC data security and access standard, selected for the security in new passports.
This enables product designs, such as NXP's new MOB6 contactless chip package, to deliver enhanced security features and durability to address the latest requirements for electronic identification documents such as e-passports, e-visas and national ID cards.
Due to the space gained by using thinner chips and chip packages within a product, passport printers, inlay manufacturers and smart card manufacturers have more flexibility to design solutions with a new structural composition.
For instance, it is now possible to accommodate extra protective material - as e-government documents can be in circulation for up to ten years - while still maintaining the overall dimensions of the solution.
The new chip also enables the design of further security features such as additional layers for laser engraving.
Alternatively, designers can create new applications which are much thinner than was previously possible.
"NXP has won more than 80% of e-passport projects globally".
"Based on our market insights, we have made a large investment ensuring that manufacturing infrastructure and solutions are ready to shape the future of e-government product and application design", said Michael Ganzera, Manager, eGovernment Marketing, NXP Semiconductors.
"Our new IC and package delivery types allow solutions which address durability requirements and sise constraints for today's e-passports and into the future as ultrathin electronic documents become a reality".
The new 75um wafer will also be incorporated in NXP's new contactless package called MOB6 for e-passports and other contactless electronic identification solutions.
Approximately 260um thick, the MOB6 is 20% thinner than existing solutions.
As a member of the NXP MOB contactless family, it is fully compatible with the MOB2 and MOB4 packages, which are currently in high volume production.
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