Product category:
Communications ICs (Wireless)
News Release from: NXP Semiconductors | Subject: BGM220
Edited by the Electronicstalk Editorial
Team on 23 March 2007
Single-chip WLAN shrinks to smaller
package
World's smallest single-package wireless LAN IC features ultralow power consumption optimised for handheld applications such as feature phones and smartphones, handheld game consoles and PDAs.
Available now from NXP, the BGM220 is billed as the world's smallest single-package 81-pin TFBGA wireless LAN (WLAN) solution, with ultralow power consumption optimised for handheld applications such as feature phones and smartphones, handheld game consoles and PDAs The BGM220 is NXP's next step in the drive to provide best-in-class WLAN solutions and lets consumers connect to the growing number of WLAN networks in offices, homes, and public places to experience rich, vibrant media on the move
This article was originally published on Electronicstalk on 23 Oct 2001 at 8.00am (UK)
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The BGM220 builds on its predecessor, the BGW211, and brings even greater benefits to OEMs by offering a significantly smaller form factor and highly optimised dynamic power management.
The new version uses the 802.11b/g WLAN standard to enhance the user connectivity experience, with a form factor allowing manufacturers to develop even smaller handheld devices.
Configured for maximum energy efficiency, the BGM220 has ultralow power consumption optimised for mobile phones and handheld devices.
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The BGM220 also provides extended wireless access by enabling simultaneous Bluetooth and WLAN connectivity.
"The proliferation of wireless networks is enabling manufacturers to develop new and engaging multimedia devices for a range of different end users", says Paul Marino, Vice President and General Manager, Business Line Connectivity, NXP Semiconductors.
"As such a greater range of nontraditional handheld devices, including personal media players and handheld game consoles, are being enabled with WLAN capabilities, NXP is committed to delivering new and insightful solutions to empower the design of innovative products in the future".
The BGM220 is a full WLAN solution, including the RF and baseband/MAC functions, in a single 5 x 5mm TFBGA package that supports the SDIO/SPI host interfaces.
Using industry-proven silicon from NXP's existing products, the BGM220 provides OEMs with a range of benefits, such as low-cost implementation, enhanced performance and flexibility to provide additional cost/performance tradeoffs, WHILE also helping speed time to market.
BGM220 reference designs include NXP's PMU for advanced power management functionality and validated front-end modules through NXP's partnership with selected module manufacturers.
The BGM220 facilitates a sub 100mm2 full, semi-discrete WLAN system implementation providing a best-in-class combination of price and size for our OEM customers.
The BGM220 is designed to meet key WFA interoperability requirements including WPA2 and WMM and supports all relevant enterprise security requirements with CCX extensions.
The BGM220 comes equipped with driver support for all major operating systems, including Windows Mobile, Windows CE, Symbian and Linux, and is designed to support a single antenna for Bluetooth and WLAN.
The BGM220 will be available for sampling during the second quarter of 2007, and mass production will commence during the fourth quarter of 2007.
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