Product category:
Discrete Power Devices
News Release from: NXP Semiconductors | Subject: SOT883 MOSFETs
Edited by the Electronicstalk Editorial
Team on 26 February 2008
Smaller outline for discrete transistors
MOSFETs deliver power dissipation and performance comparable to SOT23 but occupy only 14% of the printed circuit board space.
NXP Semiconductors has a new range of small-signal MOSFET devices housed in one of the world's smallest packages, the SOT883 Boasting an ultrasmall 1.0 x 0.6mm footprint, NXP's SOT883 MOSFETs deliver power dissipation and performance comparable to SOT23, while occupying only 14% of the printed circuit board space
This article was originally published on Electronicstalk on 23 Oct 2001 at 8.00am (UK)
Related stories
Fine-geometry process slims smart 32bit processor
HiPerSmart from Philips Semiconductors is the first 32bit smart computing platform to be manufactured using an advanced 0.18um CMOS process.
High security for smart card MCU family
Philips Semiconductors describes SmartMX as the world's first ultra-low-power cost-optimised high-performance family of smart card controller ICs.
Designed for use in a broad range of applications including DC/DC convertor modules, power supplies for LCD TV and load switching for cellular phones and other portable devices, the SOT883 MOSFETs' ultrasmall footprint, extremely low 0.5mm profile and best-in-class switching speed and very low on-resistance enable manufacturers to meet consumer demand for more compact and power-efficient products.
"Market demands for smaller portable devices with increased battery life are driving the race to fit sophisticated functionality into smaller and smaller form factors", says Dean Montano, Product Marketing Manager, NXP Semiconductors.
"Built on NXP's proven quad flat nonleaded technology, the SOT883 MOSFETs offer customers a power efficient and environmentally friendly package that still delivers the performance required by today's cellular phone and mobile computing applications".
In addition to dramatically reducing the MOSFETs' footprint, NXP has eliminated the leads, which both frees up additional board space and improves thermal performance.
This combination of superior thermal performance and on-resistance values less than 0.65ohm at 2.5V allows NXP's newest MOSFETs to offer higher current carry capacity than currently available 1.0 x 0.6mm MOSFETs.
The new series also features best in class switching speed, with turn-on times between 12 and 16ns and turn-off times between 17 and 24ns.
Manufactured using pure tin plating, high-efficiency packing techniques and green plastics that dispense with toxic flame retardants, the SOT883 MOSFET devices meet all environmental protection targets.
The high packing density also fits 10,000 devices on a standard 180mm reel, thus lowering assembly costs and inventory requirements.
Pricing starts at US $0.20 for delivery in minimum quantities of 10,000 units.
• NXP Semiconductors: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
