Papers explain stencil technologies

Photo Stencil will present two papers at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit.

Photo Stencil, the leading provider of premium stencils and additional high-end tooling for the SMT assembly industry, will present two papers at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit.

The conference is in Anaheim, California, from 8th to 10th February 2006.

Dr Bill Coleman, Vice President of Technology, will present "Step stencils", a discussion of the new technologies required by a more demanding SMT environment.

Thick metal stencils, electroform step-up stencils and special 3D electroform stencils are some of the solutions that have recently evolved.

These applications, as well as the stencil design to achieve an optimum solution will be discussed in detail in this paper on Wednesday 8th February from 1330 to 1500 local time.

Mike Burgess, Stencil Product Manager, will present the second paper on lead-free in the SMT industry.

Entitled "Lead-free solder paste printing: stencil and squeegee blade impact", this study will focus on the stencil and squeegee blade and their impact on the lead-free solder paste-printing process.

Three different stencils, three different lead-free solder pastes and five different squeegee blades are included in the overview.

The discussion will be on Thursday 9th February from 1330 to 1500 local time.

Photo Stencil will be exhibiting at the conference on Booth 801.

Coleman and Burgess will both be available at the booth to answer questions or for in-depth technical discussions.

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