Workshops examine stencil printing performance

A series of workshops during 2006 will provide information on stencil printing performance and how stencil technology and stencil design influences stencil printing performance.

Photo Stencil is organising a series of workshops during 2006 to provide information on stencil printing performance and how stencil technology and stencil design influences stencil printing performance.

Data generated by independent test laboratories during print performance studies, as well as the expertise of Dr Bill Coleman, Vice President of Technology at Photo Stencil, and Mike Burgess, Photo Stencil's Stencil Product Manager, combine to provide an excellent source of information for printing solutions.

"Our ultimate goal is to help the industry", says Dr Coleman.

"These workshops are one way that we can leverage our extensive knowledge of printing processes and tools to give our current and prospective customers a competitive advantage".

These hands-on workshops are targeted to process and quality control engineers, supervisors, managers and technicians who are involved with solder-paste screen printing, process control, solder paste selection and the assembly process.

Some of the general topics that are covered are print process and stencil technology, stencil design and applications, lead-free process impacts, SMT assembly and inspection tools, intrusive reflow and solder paste volume studies for measuring the print performance of electroformed, laser and chemical-etch stencils.

Each workshop lasts a day, starting at 0900, with a lunch break, continuing until 1600.

They are held at the Photo Stencil Colorado Springs headquarters and include a complete tour of the facility.

These workshops will be held on 17th March, 21st April, 26th May, 23rd June, 21st July, 25th August, 22nd September, 27th October and 17th November 2006.

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