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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Photo Stencil | Subject: AMTX E-Blade
Edited by the Electronicstalk Editorial Team on 30 March 2006

Squeegee blade works with less pressure

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The AMTX E-Blade electroformed squeegee blade improves print deposition, quality, uniformity and consistency.

Available now from Photo Stencil, the AMTX E-Blade electroformed squeegee blade improves print deposition, quality, uniformity and consistency With its rigid low-friction hard-nickel edge, the E-Blade provides cleaner prints, reduced stencil wear and less material waste

"The electroformed E-Blade demonstrated the lowest squeegee pressure of any other squeegee blade I have tested for both SMT and wafer bumping printing", said Rick Lathrop, Technical Service Manager of Surface Mount Materials at Heraeus.

Heraeus recently completed a study on squeegee blades.

"With lower print pressures come all of the benefits of reduced understencil wiping frequency and increased stencil life".

"The lack of paste scooping in large apertures for wafer bumping can only enhance bump coplanarity for automotive and WLCSP applications".

The AMTX E-Blade also addresses issues caused by lead-free printing.

Lead-free solder paste requires higher squeegee pressures for a clean wipe of the stencil.

Photo Stencil's E-Blade prints at 33% of the squeegee pressure of other popular squeegee blades.

High squeegee pressures result in "smear mode" printing whereas low squeegee pressure allows "sheer mode" printing.

"The E-Blade is also a perfect companion to our patented AMTX E-Fab electroform stencil", added Dr Bill Coleman, Vice President of Technology at Photo Stencil.

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