Lead-free intrusive reflow to be explained

Photo Stencil will present a paper and exhibit at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit.

Photo Stencil will present a paper and exhibit at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit.

The conference is at the Los Angeles Convention centre in Los Angeles, California, from 18th to 22nd February 2007.

Dr Bill Coleman, Vice President of Technology, will present "Lead-free intrusive reflow", an alternative to lead-free wave soldering.

The paper will demonstrate successful solder joints and fillets for resistors, DIPs and pin headers for 63 and 93mil-thick PCBs with a 6mil-thick stencil.

Advantages of intrusive reflow over wave solder will also be discussed.

This process will be discussed in detail in a poster presentation by Coleman and coauthor George Oxx of Solectron, North Carolina on Wednesday, 21st February from 1530 to 1630 local time.

Photo Stencil will be exhibiting at the conference on Booth 2729.

Coleman and Mike Burgess, Vice President of Photo Stencil, will both be available at the booth to answer questions or for in-depth technical discussions.

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