Product category:
Plugs and Sockets
News Release from: Pulse | Subject: RJ45/dual USB PulseJack
Edited by the Electronicstalk Editorial
Team on 01 May 2002
Integrated connector module combines
RJ45 and USB
Pulse has a new addition to its successful PulseJack range, the RJ45/dual USB modular jack series with integrated magnetics.
Pulse has a new addition to its successful PulseJack range, the RJ45/dual USB modular jack series with integrated magnetics The new connectors bring both electrical efficiency and space saving benefits to LAN on motherboard and PC applications
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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The RJ45/dual USB is a through hole (THT) integrated connector module (ICM) which combines a single RJ45 tab-up, with two USB 2.0 compliant connector ports.
The new connectors' internal magnetics are designed to support 10/100Base-TX applications such as LAN-on-motherboard (LOM) and PC applications.
In common with the entire PulseJack range, the RJ45/dual USB has all magnetics contained within the connector, allowing the metal shield of the connector to act as a Faraday cage, protecting the system from external noise.
It also allows internal and external PCB track lengths to be kept to a minimum, improving EMI performance and minimising cost.
Combining an RJ45 connector and two USB ports extends this economy to both boardspace and component count, helping to reduce overall system costs.
The PulseJack RJ45/dual USB connector ports are available in either 6- (J6 series) or 8- (J8 series) pin configurations.
Both meet or exceed IEEE 802.3 and ANSI x3.263 standards and deliver a minimum of 1500V RMS hipot isolation (typically 2kV).
The dual USB ports meet both USB 2.0 standards and Cat5 fast Ethernet industry performance standard.
Currently available in trays and suitable for pick and place manufacturing processes, the series offers a variety of LED colours, datarates, turns ratios, shielding, and pinout options.
Shields are available with or without EMI tabs, and an option for IC grade transfer moulded package allows the components to withstand 235C during reflow soldering processes.
Standard operating temperatures range from 0 to 70C.
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