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Product category: Terminals and Power
News Release from: Phoenix Contact | Subject: Combicon Profile and UM
Edited by the Electronicstalk Editorial Team on 15 July 2003

Mounting system puts boards on the rails

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Combicon Profile and UM printed circuit board mounting systems allow PCBs with widths from 22 to 122mm to be packaged easily and quickly for mounting on a standard DIN rail.

With the new Combicon Profile and UM printed circuit board mounting systems from Phoenix Contact, printed circuits with widths from 22 to 122mm, and of almost unlimited length, can be packaged easily and quickly for mounting on standard DIN rail An ideal choice for housing interface units, power supplies and similar electronic assemblies, the Profile and UM systems combine versatility with attractive appearance and competitive pricing

At the heart of the Combicon Profile system is a moulded PVC profile which can be supplied in almost any length.

This profile which, if necessary, can be cut into shorter lengths by the user, incorporates longitudinal lips which securely hold the printed circuit board in place.

The housing is completed by attaching end pieces with integral DIN-rail mounting feet.

The basis of the UM system is preformed modules which have integral mounting feet, and which can be clipped together to provide housings of any required length.

As with the Profile system, these housings have facilities for retaining the printed circuit board, and are completed by the addition of end pieces.

Profile mouldings are available in four sizes to accommodate boards which are 22, 42, 72 or 100/107.5mm wide, whereas UM modules are supplied in sizes to suit 72 and 107.5mm boards.

The Profile and UM printed circuit board systems are designed to offer maximum versatility, and to ensure that the systems can be customised to meet the exact requirements of the application, Phoenix Contact offers a comprehensive range of accessories.

These include marking systems and cable retainers and, for the larger sizes of mounting system, insulating covers which transform the assemblies into completely enclosed modules.

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