Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Phoenix Contact | Subject: Through-hole reflow PCB manufacturing
Edited by the Electronicstalk Editorial
Team on 10 March 2004
Through-hole reflow processes explained
at Nepcon
Phoenix Contact will be offering advice and solutions for through-hole reflow PCB manufacturing processes at Nepcon in Brighton to aid designers on lead-free evolution and SMT processes.
Phoenix Contact will be offering advice and solutions for through-hole reflow PCB manufacturing processes at Nepcon in Brighton on 26th and 27th May 2004, to aid designers on lead-free evolution and SMT processes Visitors to stand G619 will have the opportunity to obtain the company's technical guide packed with essential information on the processes, soldering essentials and selection criteria for PCB mounted connectors using SMT production methods
This article was originally published on Electronicstalk on 20 Aug 2002 at 8.00am (UK)
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To further assist designers and contract manufacturers, demonstrations of the Combicon Select software, available online and in a CD version, will take place during the two days.
In addition to the SMT products, will be a wide range of PCB terminations ranging from 2.54mm pitch, with currents up to 41A, and voltages up to 1000V, in a choice of screw, spring cage, and IDC methods.
A comprehensive range of PCB/DIN-rail adapters and housings will complete the offering at the show.
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