Product category:
PCB Connectors
News Release from: Phoenix Contact | Subject: Mini and Micro Combicon
Edited by the Electronicstalk Editorial
Team on 06 April 2004
Headers cram in more contacts
Less space for a given level of contact density is the big plus for the double-level base housing of the Mini and Micro Combicon range from Phoenix Contact.
Less space for a given level of contact density is the big plus for the double-level base housing of the Mini and Micro Combicon range from Phoenix Contact The performance spectrum has been broadened by the new high-temperature models MCD(V) 0.5-HT and MCD(V) 1.5-HT
They are suitable for use in the pin-in-paste process and can be reflow soldered.
This enables simultaneous processing with SMD components, similar to the advantages of THR technology.
Secondary processes such as wave soldering are no longer necessary.
Both ranges of components are available in either horizontal or vertical design with 2 to 12 pins.
The straight front on the double-level base housing makes for a flush fit in housing cutouts.
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