Power devices don low-profile packages

Package exhibits the same low thermal impedance as the traditional TO-220, yet stands less than 10mm above the PCB - half the height of the 45-year-old package design.

Power Integrations now offers its TopSwitch-HX series of AC/DC power conversion ICs in the new eSIP-7C eco-single-inline package.

This package exhibits the same low thermal impedance as the traditional TO-220, yet stands less than 10mm above the PCB - half the height of the 45-year-old package design.

eSIP-based designs reduce the overall height of the power supply in support of increasing market demand for slimmer electronic products such as LCD monitors, flat screen TVs and set-top boxes.

As with all Power Integrations products, the heatsink attached to the eSIP package is at source potential and therefore electrically quiet without use of an insulating pad, greatly reducing system EMI and assembly cost.

In addition to thermal and physical size benefits, the new eSIP package also reduces power supply manufacturing costs.

An easy-to-use low-cost clip reduces heatsink assembly time and improves package to heatsink contact repeatability, ensuring consistently good thermal performance in contrast to the asymmetrically mounted screw tab on the older TO-220 package design.

The clip-mounted eSIP passes shock and vibration tests to IEC60068.

Creepage and clearance - and therefore long term reliability - is improved with the eSIP package, as the pin layout is optimised to increase pin separation, and the stepped package design increases creepage distance.

According to Andrew Smith, Product Marketing Manager at Power Integrations: "The new eSIP package removes the power device as the limiting factor in the headroom required by the power supply in the new generation of slim LCD monitors, flat screen TVs and set-top boxes".

"Applications such as high power adapters for a variety of products really benefit from the low profile eSIP package".

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