Materials are a better fit for thermal management

Kunze thermal management solutions are designed to overcome imperfections in the surfaces of components to provide secure thermal performance while saving time and money in production.

When looked at closely, the surfaces of components and heatsinks are not as flat and smooth as they look.

Consequently, when a thermal insulation material is applied to cope with the heat generated by the device, it does not always fill the miniscule nooks and crannies - and this can result in air pockets and uneven contact which seriously affects the performance of the components.

The range of Kunze thermal management solutions from Power Products International is designed to overcome the imperfections in the components to provide secure thermal performance while saving time and money in production.

Unlike silicone-based conductive grease, which can be messy to apply, uneven in depth and variable in thermal performance, Kunze's materials are easily applied, clean to use and the perfect fit between component and heatsinks or PCBs.

A variety of products using silicone/polyimide and silicone/glass-fibre foils with highly thermally conductive fillers ensure excellent thermal connection between the mating surfaces and hence minimal thermal resistance.

They are also electrically isolating.

Products are available in all standard semiconductor footprints and can also be supplied in sheets which can be cut to shape to fit virtually any component.

Nonstandard shapes can also be supplied to customer specification.

Other Kunze products from PPI include thermally and/or electrically conductive foils, caps and tubes and more than 30 standard Powerclip designs available from stock for creating and maintaining the perfect contact between components and pads.

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