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Production Equipment Sales
Address:
Units 1-3 Courtlands Road
Eastbourne
BN22 8TR
UK
Telephone: (UK) +44 1323 64500
http://www.pesl.net
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Listing of all 14 news releases from Production Equipment Sales:
Printer takes on next-generation substrates
The DEK-J2002 is a "next-generation" thick-film printing development now offered by PESL.
News from Production Equipment Sales (13 August 2002)
High-quality bonders at lower prices
New from PESL at Nepcon will be a new range of high-quality bonders at low prices.
News from Production Equipment Sales (12 August 2002)
Wafer scribe takes on delicate dice
The Scribe 100-3 is another machine from PESL developed for the new generation of delicate die wafers.
News from Production Equipment Sales (12 August 2002)
Printer covers large-area substrates
New from Production Equipment Sales, the DEK-J2002 is a "next generation" thick-film printer with a large printing area for MLCC/MLCI, solar cell wafer and steel-based substrates.
News from Production Equipment Sales (12 June 2002)
Trim and form tooling for fibre-optic headers
Production Equipment Sales has a new series of tools from Fancort Industries designed to trim and form the leads on the new headers used with fibre-optic cables such as laser pumps.
News from Production Equipment Sales (16 May 2002)
Preforms seal glass to metal for packaging
Good news for laser diode packaging comes from Production Equipment Sales (PESL) in the shape of the Diemat range of glass preforms for use in hermetically sealing glass to metal.
News from Production Equipment Sales (16 April 2002)
Inline furnace avoids solder voids
The new ATV reflow/vacuum inline furnace from PESL uses the proven ATV "no void" technology for soldering of bump modules, wafers, power devices and similar components.
News from Production Equipment Sales ( 8 March 2002)
Wafer scribe handles delicate dice with care
The Scribe 100-3 is the latest machine from Production Equipment Sales (PESL) developed for the new generation of delicate die wafers.
News from Production Equipment Sales ( 6 February 2002)
Die bonder works to micron resolution
New from Production Equipment Sales is the DB-100, a high-accuracy eutectic die bonder with flip chip function and 1um pick/place resolution.
News from Production Equipment Sales (16 January 2002)
Two heads are better than one for flip chip bonder
The PESL DB5-TSV vertical-head ultrasonic flip chip bonder can be rapidly converted to horizontal ultrasonics and can be used as a highly accurate pick and place machine.
News from Production Equipment Sales (30 October 2001)
Three-piece lead reconditioning system
PESL now offers a viable solution to bent, misaligned or mangled leads, with a manually operated three-piece lead reconditioning system from Fancort.
News from Production Equipment Sales (21 September 2001)
Plasma cleaning improves packaging integrity
Production Equipment Sales claims the Itrak plasma cleaning system eliminates delamination, improving wirebond strength, ensuring void-free underfill and giving increased die attachment.
News from Production Equipment Sales (19 March 2001)
Thick-film printer is good enough for solar cells
Thick-film printing to exceptional standards is taken a significant stage further with the DEK-J 2000 from PESL for ceramic and steel-based substrates up to 305 x 305mm.
News from Production Equipment Sales (16 February 2001)
Components and boards come clean with sandblaster
Production Equipment Sales now offers the Crystal Mark Micro Sandblast system that will safely and selectively remove most types of conformal coatings from various components.
News from Production Equipment Sales (23 January 2001)
