http://www.electronicstalk.com/news/pro/pro000.html Production Equipment Sales news releases on Electronicstalk en-gb Copyright (C)2008 Pro-Talk Ltd. All rights reserved. Sat, 22 Nov 2008 08:00:00 UT Sat, 22 Nov 2008 08:00:00 UT http://www.pro-talk.com/images/protalklogo90.gif http://www.pro-talk.com/ 90 79 The DEK-J2002 is a "next-generation" thick-film printing development now offered by PESL. Tue, 13 Aug 2002 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro113.html New from PESL at Nepcon will be a new range of high-quality bonders at low prices. Mon, 12 Aug 2002 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro111.html The Scribe 100-3 is another machine from PESL developed for the new generation of delicate die wafers. Mon, 12 Aug 2002 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro112.html New from Production Equipment Sales, the DEK-J2002 is a "next generation" thick-film printer with a large printing area for MLCC/MLCI, solar cell wafer and steel-based substrates. Wed, 12 Jun 2002 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro110.html Production Equipment Sales has a new series of tools from Fancort Industries designed to trim and form the leads on the new headers used with fibre-optic cables such as laser pumps. Thu, 16 May 2002 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro109.html Good news for laser diode packaging comes from Production Equipment Sales (PESL) in the shape of the Diemat range of glass preforms for use in hermetically sealing glass to metal. Tue, 16 Apr 2002 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro108.html The new ATV reflow/vacuum inline furnace from PESL uses the proven ATV "no void" technology for soldering of bump modules, wafers, power devices and similar components. Fri, 08 Mar 2002 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro107.html The Scribe 100-3 is the latest machine from Production Equipment Sales (PESL) developed for the new generation of delicate die wafers. Wed, 06 Feb 2002 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro106.html New from Production Equipment Sales is the DB-100, a high-accuracy eutectic die bonder with flip chip function and 1um pick/place resolution. Wed, 16 Jan 2002 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro105.html The PESL DB5-TSV vertical-head ultrasonic flip chip bonder can be rapidly converted to horizontal ultrasonics and can be used as a highly accurate pick and place machine. Tue, 30 Oct 2001 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro104.html PESL now offers a viable solution to bent, misaligned or mangled leads, with a manually operated three-piece lead reconditioning system from Fancort. Fri, 21 Sep 2001 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro103.html Production Equipment Sales claims the Itrak plasma cleaning system eliminates delamination, improving wirebond strength, ensuring void-free underfill and giving increased die attachment. Mon, 19 Mar 2001 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro102.html Thick-film printing to exceptional standards is taken a significant stage further with the DEK-J 2000 from PESL for ceramic and steel-based substrates up to 305 x 305mm. Fri, 16 Feb 2001 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro101.html Production Equipment Sales now offers the Crystal Mark Micro Sandblast system that will safely and selectively remove most types of conformal coatings from various components. Tue, 23 Jan 2001 08:00:00 UT Production Equipment Sales http://www.electronicstalk.com/news/pro/pro100.html