Product category:
IC and Hybrid Processing Equipment
News Release from: Production Equipment Sales | Subject: DB-100
Edited by the Electronicstalk Editorial
Team on 16 January 2002
Die bonder works to micron resolution
New from Production Equipment Sales is the DB-100, a high-accuracy eutectic die bonder with flip chip function and 1um pick/place resolution.
New from Production Equipment Sales is the DB-100, a high-accuracy eutectic die bonder with flip chip function and 1um pick/place resolution Specifically developed for optical electronics applications the DB-100 is ideal for placing laser diodes at very precise positions
This article was originally published on Electronicstalk on 13 Aug 2002 at 8.00am (UK)
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An advanced feature of the DB-100 is its fine temperature control whereby the bond platform is held at idle temperature of 50/60C then digitally ramped up as high as 320C if required and rapidly cooled with a nitrogen blast back to idle temperature.
This virtually eliminates substrate oxidation.
The DB-100 flip option allows perfect alignment of component and substrate by means of video picture overlay as well as permitting ordinary flip chip bonding.
Fine force control of the die pickup prevents components becoming embedded in gel packs, while the control system encompasses a programmable table to move from pickup to placement.
In addition the placement control features a rotating collet to permit fine positional correction of the chip in diagonal orientation as well as the x-y table positioning.
Table size permits substrate up to 200 x 200mm while die up to 250 x 250um can be processed.
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