Wafer scribe handles delicate dice with care

The Scribe 100-3 is the latest machine from Production Equipment Sales (PESL) developed for the new generation of delicate die wafers.

The Scribe 100-3 is the latest machine from Production Equipment Sales (PESL) developed for the new generation of delicate die wafers.

High accuracy (1-micron resolution) and programmable scribing parameters make it ideal for optical applications such as laser diodes, using gallium arsenide or silicon substrates.

Wafer sizes of up to 3in and thickness of 100um upwards can be accommodated to produce die of 200um plus.

The scribing force is set at a stable low level with programmable speed control and programmable break speed.

Indeed the scribe and break parameters are entirely accessible in order to define, step by step, the full scribing sequence.

They may then be saved for each customised product.

For contamination control purposes the 100-3 uses a bottom knife and replaceable top nylon film which also allows clean breaking and optimised operational quality.

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