Inline furnace avoids solder voids

The new ATV reflow/vacuum inline furnace from PESL uses the proven ATV "no void" technology for soldering of bump modules, wafers, power devices and similar components.

The new ATV reflow/vacuum inline furnace from PESL uses the proven ATV "no void" technology for soldering of bump modules, wafers, power devices and similar components.

This is of value where, perfect connection is needed to minimise signal distortion or heat build-up.

The multiple-platen furnace can handle wafers up to 300mm diameter (assemblies 300 x 300 x 85mm) at temperatures up to 420C with a controlled temperature profile using nitrogen-based atmospheres enriched with formic acid.

This improves surface deoxidation of metal contact areas at low temperatures for best wetting of solder.

The penultimate platen is optionally configured as a vacuum stage operating at approximately 0.05mbar.

The combination of controlled atmosphere, temperature profiling and vacuum chamber ensures that voids are minimised in process and removed prior to cooling on the final stage water-cooled platen.

This comprehensive approach leads to reliable void-free results with solder paste and without flux.

This style of multistep inline oven replaces batch vacuum ovens for laser, RF, automotive, power module, IGBT, DCB, wafer bump and uBGA reflow, polyimide, epoxy and photoresist curing, and SiAu alloying.

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