High-quality bonders at lower prices
A
Production Equipment Sales product story
Edited by the Electronicstalk editorial team
Aug 12, 2002
New from PESL at Nepcon will be a new range of high-quality bonders at low prices.
New from PESL at Nepcon will be a new range of high-quality bonders at low prices.
The ITM Bonda range includes automatic aluminium wire wedge bonders, a universal rotary head gold/aluminium wire wedge bonder, a high precision multi-die bonder and an automatic high speed dispenser for up to six dispensing heads.
Bonda units are benchtop to full inline with automatic wire features and dispensing systems for wafer and waffle packs.
Rapid developments in cost-reduced technology and global sourcing ensure that new levels of value for money have been achieved by the PESL/ITM partnership down to half the cost of competing units.
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