Product category:
IC and Hybrid Processing Equipment
News Release from: Production Equipment Sales | Subject: Scribe 100-3
Edited by the Electronicstalk Editorial
Team on 12 August 2002
Wafer scribe takes on delicate dice
The Scribe 100-3 is another machine from PESL developed for the new generation of delicate die wafers.
The Scribe 100-3 is another machine from PESL developed for the new generation of delicate die wafers High accuracy (1um resolution) and programmable scribing parameters make it ideal for optical applications such as laser diodes, using gallium arsenide or silicon substrates
Wafer sizes up to 3in and thickness of 100um upwards can be accommodated to produce die of 200um plus.
The scribing force is set at a stable low level with programmable speed control and programmable break speed.
Indeed the scribe and break parameters are entirely accessible in order to define, step by step, the full scribing sequence.
They may then be saved for each customised product.
For contamination control purposes the 100-3 uses a bottom knife and replaceable top nylon film which also allows clean breaking and optimised operational quality.
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