Thermal interface doesn't suffer from gas

Low-viscosity thermal interface material is designed to meet the challenges of the high-temperature and high-stress operating conditions in electronic packaging.

Now available in the UK from Polymer Systems Technology, NuSil EPM-2493 is a low-outgasing thermal interface material.

This low-viscosity, thermal interface material was designed to meet the challenges of the high-temperature and high-stress operating conditions in electronic packaging.

The material's low outgasing property is ideal for situations, such as electro-optic systems, in which contamination is a concern.

EPM-2493's low viscosity provides users an easy-to-dispense material that flows easily around today's dimensionally intricate electronics configurations.

"We launched NuSil's line of electronic packaging materials earlier this year, with a focus on low outgasing materials", said Derek Williams-Wynn, Director of PST.

"EPM-2493 presents a low-viscosity alternative within our thermal interface material product line".

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