Product category:
Programmable Logic Devices
News Release from: QuickLogic | Subject: ArcticLink
Edited by the Electronicstalk Editorial
Team on 21 March 2007
Programmable connectivity for embedded
processors
ArcticLink embeds high-performance controllers, a programmable fabric for implementing additional controllers and peripheral connectivity, and a selectable processor interface all in a single chip.
QuickLogic's ArcticLink is a programmable connectivity platform for embedded systems processors targeting the handheld electronics product market ArcticLink reduces design time and risk by embedding high-performance controllers, programmable fabric for implementing additional controllers and peripheral connectivity, and a selectable processor interface, in a single low-power IC
This article was originally published on Electronicstalk on 29 May 2008 at 8.00am (UK)
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Programmable platform shrinks to chip scale
ArcticLink reduces design time and risk for mobile product developers by embedding hard-wired host controllers with a programmable fabric - all in a single low-power device.
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CompactFlash host controller for PolarPro, Eclipse II or ArcticLink device families provides designers with simple access to this common memory technology.
"Electronics OEMs are looking for integrated, high-performance, yet flexible connectivity solutions to enable the rapid adoption of new technology for their handheld products", says Andy Green of QuickLogic.
"The ArcticLink platform addresses their need by offering hardwired, high-performance controllers along with the ability to customise the device with a variety of additional functions".
The new device supports emerging handheld applications such as smartphones, portable media players, portable navigation systems, portable industrial products, and ExpressCard peripherals for handheld computing.
Further reading
Programmable platform connects in the hand
The ArcticLink programmable connectivity platform for embedded systems processors targets the handheld electronics product market.
Logic platforms add high-speed UART options
Offers a power-efficient single-chip solution to expand the interfacing capability of a mobile application processor, for example to support high-datarate Bluetooth.
Module checks out visual enhancements
Evaluation module allows OEMs and ODMs to see first-hand the benefits that VEE technology can bring to their mobile devices.
The hardwired interfaces in the ArcticLink device include a USB 2.0 High Speed On-the-Go (OTG) controller with integrated PHY, and a SD/SDIO/MMC/CE-ATA host controller.
The USB 2.0 OTG controller supports the maximum USB speed of 480Mbit/s and can be configured as either a host or a device (OTG).
The SD/SDIO/MMC/CE-ATA controller provides an SD card 2.0, SDIO host 2.0, MMC 4.1, or CE-ATA 1.10 compliant peripheral interface at speeds up to 52MHz.
Other functions, such as PCI, IDE, NAND Flash controller, additional SDIO host controllers, SPI, Bluetooth 2.0 UART, display controllers and other custom interfaces, can be implemented in the programmable fabric.
The innovative combination of configurability of the fixed modules and programmability of the fabric makes the ArcticLink platform extremely flexible and scalable to the needs of portable electronic designers.
"The level of integration, low power consumption and flexible architecture of the ArcticLink platform make it a compelling companion solution for Marvell PXA application and communications processor platforms" says Gary Forni, Director of Platform Enabling, Cellular Handheld Group at Marvell.
"The announcement of the ArcticLink family demonstrates the value of QuickLogic's companion solution strategy in portable electronics".
"QuickLogic is a key member of the Marvell partner program and we work closely to deliver complete system solutions to our customers".
The ArcticLink platform gives developers the ability to quickly harness a wide variety of technologies to their application processors without reducing CPU performance and utilisation.
The on-chip programmable fabric can be configured to interface to most application processors.
An innovative, internal split-bus architecture allows the host processor to establish sustained and concurrent data transfers between the various host controllers without further intervention.
By freeing the processor from these cycle-intensive I/O processing tasks, the ArcticLink platform helps reduce bill-of-material costs and increase battery life by enabling designers to use lower speed grade, lower cost application processors.
The ArcticLink solution platform is expected to begin sampling during Q2, 2007 and be in full production in Q3, 2007.
It is available in both an 8 x 8mm 121-ball CTBGA and a 12 x 12mm 196-ball TFBGA lead-free package.
ArticLink will sell for less than US $4 in high volume in 2008.
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