Product category:
Communications ICs (Wireless)
News Release from: Qualcomm | Subject: MDM9xxx-series LTE device chipsets
Edited by the Electronicstalk Editorial
Team on 08 February 2008
Chipsets upgrade for the long term
Multimode Mobile Data Modem chipsets deliver significant flexibility to the industry by supporting LTE, as well as other 3GPP and 3GPP2 standards.
Qualcomm has expanded both its device and basestation chipset roadmaps to include Long Term Evolution (LTE) The new family of three multimode Mobile Data Modem (MDM) chipsets will deliver significant flexibility to the industry by supporting LTE, as well as other 3GPP and 3GPP2 standards
This article was originally published on Electronicstalk on 5 Sep 2006 at 8.00am (UK)
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The MDM9xxx-series chipsets will allow UMTS and CDMA2000 operators to upgrade seamlessly to future LTE services while preserving backward compatibility to their existing 3G UMTS and CDMA2000 networks.
The LTE solutions are scheduled to sample in the second quarter of 2009.
"Qualcomm is in a very unique position with LTE, being one of the very few companies that will be able to offer multimode solutions that deliver an upgrade path for operators looking to complement their existing 3G networks with LTE", says Steve Mollenkopf, senior vice president of product management for Qualcomm CDMA Technologies.
"We are pleased that we will be able to leverage our industry-leading technology position to offer LTE solutions to our customers".
The new family of MDM9xxx-series LTE device chipsets will include: the MDM9200 chipset, designed to support UMTS, HSPA+ and LTE; the MDM9800 chipset designed to support EV-DO Rev B, UMB and LTE; and the MDM9600 chipset designed to support UMTS, HSPA+, EV-DO Rev B, UMB and LTE.
All three MDM9xxx-series chipsets will offer full backward compatibility.
The chipsets will support FDD and TDD duplex modes, different carrier bandwidths and will be capable of supporting peak datarates of up to 50Mbit/s on the downlink and 25Mbit/s on the uplink.
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