Product category:
Embedded Computing and Control
News Release from: RadiSys Corporation | Subject: Procelerant family
Edited by the Electronicstalk Editorial
Team on 24 February 2005
Embedded family expands into COM Express
format
This week at Embedded World, Radisys released five new products in its Procelerant family of embedded platforms.
This week at Embedded World, Radisys released five new products in its Procelerant family of embedded platforms The Procelerant portfolio includes system-level platforms and individual building blocks all designed to help customers develop better products faster and more economically
This article was originally published on Electronicstalk on 25 Feb 2005 at 8.00am (UK)
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The Radisys Procelerant CE is the first in a series of COM Express-compliant products.
The company also adds four new Procelerant Endura motherboards to its product lineup.
With these additions Radisys offers a broad range of solutions for OEMs developing next generation medical equipment, test and measurement systems, transaction terminals and industrial control equipment.
The Procelerant CE is one of the industry's first platforms based on COM Express, the new PICMG (PCI Industrial Computer Manufacturers Group) standard for PCI Express in Computer-on-Modules (COMs).
The Procelerant Endura motherboards are one of the industry's first to support the latest Mobile Intel 915GM Express chipset.
"Our strategy is to deliver standards-based, fully integrated, application-ready embedded platforms that allow customers to focus their resources on developing features that differentiate their products", said Wade Clowes, General Manager, Commercial Segment at Radisys.
"Rounding out our portfolio with COM Express-compliant products and adding new long life motherboards that support the latest Intel chipsets is further proof of our commitment to meet customer's current and future needs".
Radisys offers products based on a variety of standard form factors including AdvancedTCA, COM Express, CompactPCI, PrPMC, PCI, ATX and uATX.
This ensures OEMs who are designing embedded products, from handheld devices to large free standing systems, are guaranteed a platform that meets their requirements whether they need scalable, long life/low power motherboards or small compute platforms that can be leveraged across a variety of products.
"Radisys played a key role in developing the COM Express standard", said Doug Davis, Vice President, Digital Enterprise Group, General Manager, Infrastructure Processor Division, Intel Corp.
"This work with key industry players combined with Radisys' embedded platforms based on the latest Intel products can significantly lower customers' time to market".
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