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TI's new DSP signals RapidIO explosion
The RapidIO Trade Association has welcomed TI's launch of the first RapidIO DSP as an indicator that market leaders are on track to deliver a wide range of RapidIO products throughout 2005.
The RapidIO Trade Association, a membership-based organisation dedicated to driving the RapidIO interconnect architecture, has cited Texas Instruments' launch of the TMS320TCI6482, the first RapidIO DSP, as an indicator that market leaders are on track to deliver a wide range of RapidIO products throughout 2005.
"Texas Instruments epitomises the high quality of the companies and individuals comprising the RapidIO ecosystem - a talented team of market leaders and experts dedicated to making a tangible investment in delivering RapidIO-based products to market", said Iain Scott, Executive Director of the RapidIO Trade Association.
"The TMS320TCI6482 is an important component that facilitates higher speed interconnectivity and more reliable performance in the design of advanced communications systems".
The TMS320TCI6482 device supports four serial 1x links that can be combined to form a single 4x link, allowing connectivity to multiple RapidIO enabled devices or to one high bandwidth RapidIO device.
Link datarates supported on this device are 1.25, 2.5 and 3.125Gbaud, effectively allowing scaleable data bandwidth from 1 to 10Gbit/s.
Built on TI's industry leading 90nm process, the TCI6482's unique combination of high performance and low power make it the most power efficient DSP for wireless infrastructure systems.
In addition, the device supports logical layer messaging as well as I/O accesses.
Messaging features built into TI's DSP BIOS operating system eases communication between DSPs and other processors.
RapidIO's hardware-based error handling techniques ensure systems-level reliability through advanced failure management.
The RapidIO Interconnect Architecture, the only open standard designed specifically for embedded applications, is compatible with the most popular integrated communications processors, host processors, and networking digital signal processors, is a high-performance, packet-switched, interconnect technology.
It addresses the high-performance embedded industry's need for reliability, increased bandwidth, and faster bus speeds in an intra-system interconnect.
The RapidIO interconnect allows chip-to-chip and board-to-board communications at performance levels scaling to 10Gbit/s and beyond.
Designed specifically to achieve high-performance, low-cost, reliable and scalable system connectivity in embedded, networking, and communications devices, the RapidIO specification is being embraced by communications systems OEMs, computer systems manufacturers and silicon vendors around the world.
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