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News Release from: RapidIO Trade Association
Edited by the Electronicstalk Editorial
Team on 24 August 2006
Demonstration shows off multivendor
interoperation
A ground-breaking multivendor demonstration that included 16 RapidIO ecosystem members was held during the RapidIO Trade Association's Boston Global Design Summit last week.
A ground-breaking multivendor demonstration that included 16 RapidIO ecosystem members was held during the RapidIO Trade Association's Boston Global Design Summit last week During the demonstration, silicon from seven different semiconductor vendors interoperated within a common software application in the same system, for the first time
This article was originally published on Electronicstalk on 7 Dec 2006 at 8.00am (UK)
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The demonstration showed the fundamental principals of RapidIO discovery, enumeration and initialisation of multivendor devices in the same system using the network management and diagnostic tool produced by Fabric Embedded Tools Corporation called RapidFET.
"The key to a healthy ecosystem that fosters aggressive adoption of a technology by OEMs is a strong mix of semiconductor, board level hardware, board level software, and tool vendors", said Tom Cox, Executive Director of the RapidIO Trade Association.
"This extraordinary demonstration underscores the strength of the RapidIO ecosystem, the ability of the companies and their products to work together seamlessly, and the reason OEMs are embracing RapidIO as the interconnect architecture of choice in high performance designs".
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Produced by Fabric Embedded Tools for the RapidIO Trade Association, the multivendor demonstration illustrated the robustness of the ecosystem, and incorporated commercially available semiconductor vendor evaluationboards, productionboards, software, and test tools.
Agilent, as part of FuturePlus's demonstration, Altera, CS Electronics, Embedded Planet, Fabric Embedded Tools, Freescale Semiconductor, FuturePlus Systems, IDT, Jennic, Mercury Computer, PMC-Sierra, Silicon Turnkey Express, Spectrum Digital, Texas Instruments, Tundra Semiconductor, and Zarlink all participated in the demonstration.
The multivendor demonstration was held during the Global RapidIO Design Summit in Boston which drew more than 50 delegates who participated in highly interactive discussions on design, deployment and the RapidIO technology roadmap.
"The response to this event was extremely positive, with significant discussions around design issues as they related to current projects", said Cox.
"It was clear from the delegates that RapidIO designs are underway in virtually all segments of the embedded market".
In addition to the Boston event, Global RapidIO Design Summits have been scheduled throughout Asia-Pacific this year.
Summits will be held in Tokyo, Japan on 20th October 2006 and in Bangalore, India on 29th November 2006.
Details on these and other events can be found the association's website.
Dates of these events are subject to change.
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