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News Release from: RapidIO Trade Association
Edited by the Electronicstalk Editorial
Team on 03 November 2006
Design summits spread into Asia
On the heels of its highly successful Global RapidIO Design Summit in Boston, the RapidIO Trade Association has completed five further immensely successful Summits in Japan and China.
On the heels of its highly successful Global RapidIO Design Summit in Boston, the RapidIO Trade Association has completed five further immensely successful summits in Japan and China These summits focused on Serial RapidIO technology, interoperability, applications and designs, and featured key members of the RapidIO ecosystem including Enea Systems, Freescale Semiconductor, FuturePlus Systems, Integrated Device Technology (IDT), Mercury Computer Systems, PMC-Sierra, Silicon Turnkey Express, Texas Instruments, Tundra Semiconductor and Xilinx
This article was originally published on Electronicstalk on 7 Dec 2006 at 8.00am (UK)
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In addition, demand for RapidIO standard and product information reached a peak during the Texas Instruments Developer Conference (TIDC) in Shenzhen, China.
"The interest in RapidIO technology and products for a wide range of OEM designs throughout Asia-Pacific is among the strongest in the world and growing rapidly", said Tom Cox, Executive Director of the RapidIO Trade Association.
"Not only was the response to our regional events extremely welcomed, but the depth of discussion around current and future designs made it clear that RapidIO is truly a global standard that is being widely adopted as the technology of choice in the embedded market".
The Global RapidIO Design Summits drew more than 150 delegates who participated in highly interactive discussions on design, deployment and the RapidIO technology roadmap.
Presentations, which can be downloaded from the association's website, featured: "A technology introduction"; "A comparison Of Serial RapidIO, Ethernet and PCIe"; "The benefits Of RapidIO in the communication infrastructure"; "Serial RapidIO IP and system solutions"; "Serial RapidIO and DSP clusters in an AMC form factor"; "A Node B+Wimax application note"; "A RapidIO 10G application example"; "The distributed transparent inter process communications for RapidIO"; and "Planning ahead for Serial RapidIO validation".
In addition to the full-day of presentations and interactive discussions, the summits featured working demonstrations from industry leaders showing the fundamental principals of RapidIO discovery, enumeration and initialisation of multivendor devices in the same system, demonstrating the robustness of the RapidIO ecosystem.
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