FRAMs shrink into DFN packaging

Ramtron International is now producing select ferroelectric RAM products in DFN (dual flat no-lead) plastic packaging.

Ramtron International is now producing select FRAM (ferroelectric random access memory) products in DFN (dual flat no-lead) plastic packaging.

The existing FRAM products that are now offered in this thin package with a small PCB footprint are the FM24CL16, FM25CL64 and FM25L256 devices.

The FM24CL16 is offered in a 3.0 x 6.4mm package, and the FM25CL64 and FM25L256 are available in a 4.0 x 4.5mm package.

Both packages are only 0.75mm high.

The 3.0 x 6.4mm version is compatible with industry-standard TSSOP8 packages, making it suitable for a drop-in replacement.

DFN packaging is planned for additional Ramtron FRAM products.

All new DFN packages are provided in "green" lead-free packaging that is compliant with EC RoHS legislation.

DFN advanced packaging enables designers to use fast-write, high-endurance FRAM in low-headroom applications, while reducing cost and increasing available board space for other functions.

These tiny memories are targeted for consumer video games, disposable medical tags and HDTV sets.

Back to top