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Product category: Circuit Protection Devices
News Release from: Raychem Circuit Protection | Subject: PolySwitch SMD050-2018
Edited by the Electronicstalk Editorial Team on 15 November 2002

Resettable fuse fits Ethernet and VoIP
specs

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The PolySwitch SMD050-2018 is a resettable device for telecomms and networking applications.

The PolySwitch SMD050-2018 is a resettable device for telecomms and networking applications The SMD050-2018 device helps provide resettable overcurrent protection for voice over IP (VoIP) and powered Ethernet equipment, and is designed to meet the voltage and hold current requirements of the IEEE802.3af Ethernet specification

The SMD050-2018 resettable device is designed to help facilitate the development of reliable, carrier-grade VoIP systems.

When installed between the power source and output of a powered Ethernet device, the SMD050-2018 device provides a second layer of defence in the power management circuit.

Should any power control FET fail short, the PolySwitch device shuts down the individual port and helps prevent a system-wide power failure.

Once the fault condition and power are removed, the device resets allowing the affected equipment to return to normal operating conditions.

When compared with the alternative second-layer solution, a single-shot fuse, the use of the SMD050-2018 device helps overcome the fatigue failures, unrecoverable nuisance tripping, and installation problems associated with traditional single-use fuses.

"This device was developed in response to new circuit protection requirements as described in the IEEE802.3af powered Ethernet specification, and plays a key role in the design of carrier-grade, reliable, VoIP systems", said Adrian Mikolajczak, Multimedia Market Manager for Raychem Circuit Protection.

"With an FIT of less than 0.01 when used at rated voltages, the PolySwitch SMD050-2018 device offers a new class of reliability and survivability in the field", he added.

The PolySwitch SMD050-2018 surface-mount device is available in tape and reel packaging for compatibility with high-volume manufacturing.

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