Product category:
Exhibitions, Courses, Conferences and Training
News Release from: Reed Exhibitions (UK)
Edited by the Electronicstalk Editorial
Team on 12 November 2002
Catch up with Nepcon seminar papers
Following the success of this year's Nepcon Process Technology Seminars, the papers from the programme are now available to download free from either the Nepcon and SMART Group websites.
Following the success of this year's Nepcon Process Technology Seminars, the papers from the programme are now available to download free from either the Nepcon and SMART Group websites The extremely well-received seminar papers were written and presented by some of Europe's leading trade groups and companies
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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"Organised by the SMART Group and TISA, the Process Technology Seminars have become an integral part of Nepcon", comments Justin Tadman, Exhibition Director.
"People attend the event to gather information and, by making the seminar papers available to download for free via the websites, we are helping to meet this requirement all year round.
Nepcon Brighton will take this concept even further by being even more seminar-based, with presentations from leading speakers from a very wide range of industry sectors".
The 2002 seminar programme focused on a number of pressing issues within the industry, and was fronted by the results of the first stage of The SMART Group/DTI's PPM Benchmarking project.
With the aim of providing the electronics industry with a monthly average parts per million defect level for stencil printing, component placement, reflow and wave soldering, the project will enable companies to compare process yields and benchmark their process against other similar products or companies, free of charge.
The results are now available.
Also featured heavily in the seminar programme was lead-free assembly and soldering, and other areas to be covered in an extremely varied line up included: optoelectronics; 0201 chip component design; pin-in-hole reflow assembly; complementary test techniques; nitrogen soldering; PCB reliability; and organic substrates.
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