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Brighton seminars tackle process technology issues

Edited by the Electronicstalk editorial team Mar 4, 2003

The Nepcon Brighton process technology seminar programme will cover a diverse number of topics this year, from circuit design to thermal management to PCB purchasing decisions.

The Nepcon Brighton process technology seminar programme will cover a diverse number of topics this year, from circuit design to thermal management to PCB purchasing decisions.

The lineup, put together by the SMART Group, tackles head-on some interesting and highly pertinent issues that are set to make it one of the most captivating programmes in recent years.

Free to attend, the varied schedule is part of the new and highly praised approach implemented by Reed Exhibitions at this year's event, as Justin Tadman, Nepcon Exhibition Director, explains: "Nepcon Brighton will be more focused than the NEC show, with an emphasis on visitors gaining knowledge and taking away something truly unique.

The process technology seminars are always extremely popular and well-attended, and it is advisable that visitors book places in advance wherever possible".

Situated in a purpose-built seminar theatre on the show floor, the ten 25min seminars take place on the hour between 11am and 3pm on both days of the show.

The half hour gaps between each presentation allow plenty of time throughout the day to plan meetings and spend time talking to exhibitors without missing any topics that may be of interest.

Bob Willis, Technical Director of the SMART Group, comments: "Each presentation is guaranteed to be of the highest quality, with specific relevance to issues relating to current and future manufacturing challenges".

Bookings can be made on the Nepcon website.

The programme commences at 11am on Wednesday 11th June with a presentation on "Thermal management techniques for advanced SMT reliability".

Further topics covered on the first day include: "Buying printed boards from the UK or Far East"; "Combined philosophy that delivers competitive advantage in speed, flexibility and quality"; "Managing your surface mount assembly operation"; and "Press fit inspection and quality control".

Thursday 12th June sees five more equally distinct seminars: "Challenges in flexible circuit design and assembly"; "From chaos to flow - mapping the supplier to customer flow"; "A guide to changing to lead free solders"; "BGA process control and defect recognition"; and "Inspection and quality control in automotive electronics".