Lead-free experience at Nepcon

Following its sell-out success at last year's event, the SMART Group "Lead-free hands-on experience" returns to Nepcon 2004.

Following its sell-out success at last year's event, the SMART Group "Lead-free hands-on experience" returns to Nepcon 2004.

The "Experience 2" provides an unrivalled opportunity for visitors to bring themselves bang up to date with all of the issues surrounding the 2006 lead-free legislation, as well as offering the chance to gain hands-on experience with all aspects of lead-free materials and production equipment.

A purpose-built feature area on the show floor, the "Lead-free experience 2" allows engineers to see and to use production equipment with lead-free alternative alloys featuring surface mount and through-hole terminations, and to discuss the current process experience of soldering, inspection, component requirements, printed board design/specification and product reliability.

Delegates can also bring their own board designs and process issues for discussion, as well as having all of their questions answered.

"The 2006 lead-free initiative is one of the most significant developments in the electronics manufacturing industry in years, and it's coming ever-closer", comments Group Exhibition Director, Justin Tadman.

"The 'Lead-free experience 2' will tackle the issues raised by the legislation head-on, allowing Nepcon visitors to gain hands-on experience with different lead-free alloys, try lead-free soldering and rework of both through-hole and SMT, inspect and test different joints and compare convection and vapour phase reflow.

As such, The SMART Group has put together the definitive reference point for lead-free, and it can only be experienced at Nepcon".

"Lead-free experience 2" delegates will receive a special CD-ROM featuring lead-free information from each of the partner companies contributing to the feature, as well as copies of all the presentation material.

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