Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Renesas Technology Europe
Edited by the Electronicstalk Editorial
Team on 10 October 2005
SiP shipments top 100 million
Renesas Technology has achieved an important milestone in its SiP (system in package) business, becoming the world's first company to ship 100 million SiP units.
Renesas Technology has achieved an important milestone in its SiP (system in package) business, becoming the world's first company to ship 100 million SiP units In recent years demand for products combining sophisticated functionality and compact sise has increased dramatically in the digital consumer electronics market, which includes products such as mobile phones and digital still cameras
This article was originally published on Electronicstalk on 15 Apr 2004 at 8.00am (UK)
Related stories
Five-layer package takes in MCU, logic and memory
A novel five-layer stacked SiP (system in package) device combines a high-performance SuperH microprocessor, logic LSI chip and memory chips in a single package.
Microcontroller shinks to metering applications
The H8/38004F MCU offers extremely low power consumption together with 32Kbyte single-supply on-chip Flash memory and is the first in the SLP series that is available in a 64-pin quad flatpack.
In addition, product cycles have become notably shorter.
In response to this demand, SoC products, which integrate multiple functions on a single-chip LSI device, have achieved ever-higher levels of integration and scale.
However, finer wafer processes have led to increased development costs and longer development cycles.
Further reading
Platform speeds SH-3 applications development
The EDOSK7705 is a low-cost high-integration OS reference platform for the SH7705 32bit microprocessor.
Microcontroller takes third serial line onboard
The latest microcontroller from Renesas Technology Europe incorporates three high-performance serial channels.
RISC processor takes network security onboard
The SH7710 32bit RISC microprocessor features an IPsec accelerator for fast encryption and communication processing.
As a result, demand is increasing rapidly for SiP products, which combine multiple chips, such as SoCs or microcomputer logic chips and memory chips, in a single package.
The SiP approach allows a high level of semiconductor integration while shortening the time required for development.
As SiPs can combine multiple LSI devices in a single package, they offer an effective way to develop, in a short period of time, smaller electronic products offering sophisticated functions.
This provides manufacturers the opportunity to get into promising new business markets quickly.
In addition, by encasing the main LSI device in the main substrate of the SiP, electromagnetic interference (EMI) can be reduced and high-speed bus designs become easier to implement.
The resulting reduction in the design and development time devoted to dealing with EMI, etc., translates into a corresponding reduction in development costs.
Furthermore, the customer can employ smaller system boards with fewer layers in their products.
This reduces the cost of the system boards and keeps system costs down overall.
Renesas Technology took note of the rising demand for SiP products and in 2000 became one of the first companies in the industry to offer such products.
Renesas provides comprehensive support to customers, ranging from the design stage through volume production and testing to boost reliability.
Rather than simply combining existing LSI (SoC) devices in the conventional way, Renesas designs new SoC devices that are optimised for use in SiP products and is strongly conscious of SiP requirements in its SoC development work.
Renesas does not consider SiPs to be merely multiple SoC devices combined in a single package.
The company has positioned its entire line of SiP products in the SIP (solution integrated product) category, and these products represent the synthesis of the vast product and technology resources of Renesas Technology.
As part of its efforts to develop its SIP business, the company has established an SIP development centre as a unified organisational structure specialising in the SIP business.
In fiscal 2004, Renesas Technology shipped 50 million units per year, and shipments are expected to continue increasing steadily, with annual shipments exceeding 300 million units in fiscal 2008.
In the years ahead Renesas Technology will continue to make an important contribution to the emergence of ubiquitous networking by offering an ever broader array of advanced SiP products as SIP solutions.
• Renesas Technology Europe: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
