Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Renesas Technology Europe | Subject: H8S/2215RF
Edited by the Electronicstalk Editorial
Team on 25 April 2006
16bit MCU integrates more in less space
A low power 16bit microcontroller combines 24MHz CPU performance with 256Kbyte Flash and USB in a compact 10 x 10mm CSP package.
Renesas Technology Europe has announced the H8S/2215RF, a low power 16bit microcontroller combining 24MHz CPU performance with 256Kbyte Flash and USB in a compact 10 x 10mm CSP package The device is ideal for highly functional consumer and industrial applications where component space is limited, such as sensors, barcode scanners, printers and health monitoring systems
This article was originally published on Electronicstalk on 15 Apr 2004 at 8.00am (UK)
Related stories
Five-layer package takes in MCU, logic and memory
A novel five-layer stacked SiP (system in package) device combines a high-performance SuperH microprocessor, logic LSI chip and memory chips in a single package.
Microcontroller shinks to metering applications
The H8/38004F MCU offers extremely low power consumption together with 32Kbyte single-supply on-chip Flash memory and is the first in the SLP series that is available in a 64-pin quad flatpack.
The superior security offered by BGA packages means the solution is also suitable for electronic point of sale (EPOS).
In addition to 256Kbyte Flash memory and 16Kbyte RAM, the device is equipped with a peripheral set including direct memory access controller (DMAC), a data transfer controller (DTC), a 16bit timer pulse unit (TPU), an 8bit timer (TMR), a watchdog timer (WDT), a universal serial bus (USB), three channels of serial communication interfaces (SCIs), a 10bit A/D convertor, and a 8bit D/A convertor.
The popular H8S/221x series now includes three devices with full speed USB: H8S/2212F, H8S/2215RF and H8S/2218F.
The series offers different memory and package options ranging from 128 to 256Kbyte and 64 to 112 pins.
The H8S/2215RF's ability to transfer data in four modes, namely: Control, Interrupt, Bulk and Isochronous, make it ideally suited for use in office automation and communication equipment.
The H8S/2215RF is available in both 120-pin TQFP (thin quad flat pack) and 112-pin BGA (ball grid array) packages, which offer benefits including superior electrical characteristics, compatibility with conventional soldering techniques and a very low soldering failure rate, due to their self-align effect.
Samples of the H8S/2215RF are available now.
The device is supported by JTAG/OCD (E10A-USB) and a starter kit available in July 2006.
• Renesas Technology Europe: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
