High density racks cooled by liquid

A Rittal product story
Edited by the Electronicstalk editorial team Mar 7, 2007

Liquid cooling package solves problems of high power dissipation of up to 30kW as standard per rack.

In today's environment, increased packing densities and ever increasing processor speeds are causing more complex thermal issues.

Rittal's LCP liquid cooling package solves the problem of high power dissipation of up to 30kW as standard per rack.

Fitted as an environmentally controlled chamber on the side panel of the server rack, the LCP has major advantages such as even distribution of the chilled air in front of the 19in level, complete accessibility and cooling of either one or two server racks with one LCP.

The cold air is blown in horizontally, directly in front of the rows of servers, to ensure smooth thermal conditions.

LCP possesses its own regulation system, which can be integrated into a monitoring network via Computer Multi Control Top Concept (CMC-TC), offering comprehensive safety features.

Alongside TUV and GS certifications, which guarantee proven safety, the UL/cUL accreditations endorse LCP as a tested and approved product for the US and Canadian markets.

Find out more about this article. Request a brochure, download technical specifications and request samples here.

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