Cooling system includes controller and fan tray

Rittal has developed a highly efficient cooling method primarily for use with MicroTCA systems, capable of heat removal of up to 1200W.

Rittal has developed a highly efficient cooling method primarily for use with MicroTCA systems, capable of heat removal of up to 1200W.

The 482.6mm rack-mountable Compact Cooling Package (CCP) comprises a controller managed air/water heat exchanger, 300mm deep, and a 482.6mm fan tray, which can be supplied as a fully wired and piped re-cooling system.

Supporting all leading IPMI and Rittal CMC-TC (Computer-Multi-Control Top-Concept) protocols, it can be controlled via a Central Processing Unit (CPU).

If a fan breaks down or in the event of extreme air temperatures (96 hours at 55C), the system still remains operational.

The use of robust controllers and sensors ensures secure cooling and allows the system to be reliably controlled automatically.

Modular and easy to install, the system can be matched to specific, actual cooling needs due to its flexibility.

Applications with ambient temperatures of up to 55C and at 1800m above sea level are possible.

Rittal's CCP enables efficient dispersal of heat, keeping the electronic systems at constant low temperatures by monitoring the internal temperature.

Up to two MicroTCA shelves can be maintained with a single system, which can easily be applied to any vertically cooled rackmount electronics.

Slide-in electronic components can be cooled by a powerful air/water heat exchanger (including a fan unit) with a cooling output of to 1200W.

This innovation ensures that installed boards are cooled uniformly, effectively and economically, allowing up to 90% of the heat loads that arise from MicroTCA shelves and microcomputer packaging systems to be efficiently dissipated.

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