Product category:
Intellectual Property Cores
News Release from: Rambus
Edited by the Electronicstalk Editorial
Team on 17 October 2006
IBM veteran heads up memory development
Dr Gary Bronner has joined Rambus to serve as Technical Director.
Dr Gary Bronner has joined Rambus to serve as Technical Director Dr Bronner joins Rambus following 21 years with IBM, where he led a number of programmes, including the DRAM Development Alliance of IBM and Infineon, spearheading the development of all generations of IBM's leading-edge DRAM technology and products
This article was originally published on Electronicstalk on 17 Nov 2003 at 8.00am (UK)
Related stories
PHY enables Advanced Switching interconnect line
StarGen is using Rambus's RaSer PHY IP in the development of its StarXpress product line, based on the forthcoming Advanced Switching (AS) standard.
PCI Express core enables Fibre Channel ASICs
QLogic Corp has incorporated the Rambus PCI Express digital controller core in its new line of Fibre Channel storage processor ASICs.
In addition, Dr Bronner was the project leader of the SOI Development Alliance of IBM, AMD, Sony and Toshiba.
At Rambus, Dr Bronner will focus on memory technology development.
"Gary is highly respected in the industry for his leadership contributions in process technologies and DRAM design", said Kevin Donnelly, Senior Vice President of Engineering at Rambus.
"Gary joins a world-class team of engineers and scientists at Rambus that have delivered tremendous value to the industry through innovations and technology foundational to nearly all digital electronic products".
Dr Bronner joined IBM in 1985 and has served in multiple roles across the Research Division as well as IBM's Microelectronics Division.
He received his bachelor's degree in electrical engineering from Brown University and his master's degree and PhD from Stanford University.
He holds 64 issued patents and has published multiple technical disclosures and articles in reference journals.
Dr Bronner has received a Research Division Outstanding Contribution Award, a Division Award, an Outstanding Technical Achievement Award, a Division Excellence Award, and a Division Patent Portfolio Award.
• Rambus: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page

