Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Rogers Corp | Subject: R/flex 3000 family
Edited by the Electronicstalk Editorial
Team on 11 March 2005
LCP-based circuit materials show up in
Paris
Rogers Corp will be showcasing its R/flex 3000 family of liquid crystalline polymer based circuit materials at this year's RF and Hyper Exhibition in Paris.
Rogers Corp will be showcasing its R/flex 3000 family of liquid crystalline polymer (LCP) based circuit materials at this year's RF and Hyper Exhibition from 22nd to 24th March in Paris Rogers will be exhibiting at the show on Booth C30 with its French agent/distributor MB Electronique
This article was originally published on Electronicstalk on 9 Jul 2003 at 8.00am (UK)
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Complementing the R/flex 3600 LCP single-clad laminate, the new R/flex 3850 double-clad laminate offers a low relative permittivity (2.9) for controlled impedance combined with excellent dimensional stability for dense fine-line applications.
R/flex 3850 laminate is produced in a range of copper and film thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Rogers' new R/flex 3000 family of materials now includes a single-clad lower melt point and a double-clad high melt temperature laminate.
These materials offer a unique combination of mechanical, electrical, thermal, and environmental properties for tightly controlled impedance flex interconnections, next-generation wireless handsets, high-density flip-chip packages and moisture-resistant sensors.
Other products to be highlighted at the exhibition include RT/duroid 6202 material - an addition to Rogers' traditional microwave laminates, this material provides the keyfeature of improved dimensional stability while supporting the highest performance requirements for the most demanding applications for frequencies of 3 to over 90GHz.
RO4000 Series high frequency circuit material is a glass-reinforced hydrocarbon/ceramic thermoset laminate system designed for performance sensitive, high volume commercial applications.
These laminates and prepregs are designed to offer superior high frequency performance and low cost circuit fabrication.
The result is a low loss material, which can be fabricated using standard epoxy/glass (FR4) processes.
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