Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Rogers Corp
Edited by the Electronicstalk Editorial
Team on 22 August 2005
High-tech circuit materials on show
Rogers will showcase its R/flex 3000 family of liquid crystalline polymer based circuit materials and RO4000 series high frequency circuit materials at DesignCon East in Worcester Massachusetts.
Rogers will showcase its R/flex 3000 family of liquid crystalline polymer based circuit materials and RO4000 series high frequency circuit materials on Booth 200 at DesignCon East from 19th to 21st September 2005 in Worcester Massachusetts R/flex 3000 family of liquid crystalline polymer (LCP)-based circuit materials include the R/flex 3600 LCP single-clad laminate and the R/flex 3850 double-clad laminate
This article was originally published on Electronicstalk on 9 Jul 2003 at 8.00am (UK)
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R/flex 3850 laminate is produced in a range of copper and film thicknesses, just as the single-clad laminate, and is available in standard panel formats.
These materials offer a unique combination of mechanical, electrical, thermal and environmental properties for tightly controlled impedance flex interconnections, next-generation wireless handsets, high-density flip-chip packages and moisture-resistance sensors.
RO4000 series high frequency circuit material is a glass-reinforced hydrocarbon/ceramic thermoset laminate system designed for performance sensitive, high volume commercial applications.
These laminates and prepregs are designed to offer superior high frequency performance and low cost circuit fabrication.
The result is a low loss material, which can be fabricated using standard epoxy/glass (FR4) processes.
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