Green circuit materials go on show

Rogers Corp will Showcase a range of "green" high frequency circuit materials at IPC Expo 06 from 8th to 10th February in Anaheim, California.

Rogers Corp will Showcase a range of "green" high frequency circuit materials at IPC Expo 06 from 8th to 10th February in Anaheim, California.

RO4000 Series high frequency circuit material is a glass-reinforced hydrocarbon/ceramic thermoset laminate system designed for performance sensitive, high volume commercial applications.

These laminates and prepregs are designed to offer superior high frequency performance and low cost circuit fabrication.

The result is a low loss material, which can be fabricated using standard epoxy/glass (FR4) processes.

RO4000 leads the industry in lead-free processing capability and meets the RoHS standards.

R/flex Crystal flexible circuit materials with a transparent epoxy-based adhesive system lead the industry in performance for cellular phone handset hinge flex, while offering the versatility for a diverse range of applications such as lap top computers and other handheld electronic equipment.

The proven R/flex Crystal system has set the standard for the increasing performance and design demands imposed on today's flexible circuit materials.

Inherent flame retardant performance, superior adhesion, dynamic flexibility, low and predictable dimensional change, among other features, make this system ideal for high density circuitry in dynamic or static applications.

2L-FCCL adhesiveless, all-polyimide (API) flexible circuit materials are designed for use in cellphone hinge flex, LCD interconnection, and other applications.

Offerings of the two new lines of 2L-FCCL API materials include R/flex AP 200 material, a single-clad, cast-on type product and Mitsui Chemicals Neoflex NFX material, a double-clad, laminated-type product.

Both are available in rolls 250 and 500mm wide.

The new adhesiveless products are polyimide-based, made by directly bonding polyimide onto adhesion-treated copper foil, without the use of conventional adhesives.

They are ideally suited for the manufacturing of circuits intended for use in high-density designs, harsh working environments, dynamic flexing applications as well as thin multilayer and rigid-flex circuits.

R/flex 8080 liquid photoimageable covercoats help achieve the ultrafine patterns needed for today's high density flexible printed circuits.

Offering uniform coverage and reliable performance in mass production processes, R/flex 8080 materials allow manufacturing of high precision patterns unattainable through conventional screen printing.

The R/flex 3000 family of liquid crystalline polymer (LCP)-based circuit materials includes the R/flex 3600 LCP single-clad laminate and the R/flex 3850 double-clad laminate.

R/flex 3850 laminate is produced in a range of copper and film thicknesses, just as the single-clad laminate, and is available in standard panel formats.

These materials offer a unique combination of mechanical, electrical, thermal, and environmental properties for tightly controlled impedance flex interconnections, next-generation wireless handsets, high-density flip-chip packages and moisture-resistant sensors.

R/flex 3000 is a halogen-free material, and meets the RoHS standards.

RT/duroid 6202 material provides the key feature of improved dimensional stability while supporting the highest performance requirements for the most demanding applications for frequencies from 3 to over 90GHz.

Its other key properties include superior electrical characteristics and highly predictable performance.

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