Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Rogers Corp
Edited by the Electronicstalk Editorial
Team on 10 January 2006
Circuit materials show up at DesignCon
West
Rogers will showcase its R/flex 3000 and RO4000 Series circuit materials for advanced packaging applications at this year's DesignCon West.
Rogers will showcase its R/flex 3000 family of liquid crystalline polymer (LCP)-based circuit materials and RO4000 Series high frequency circuit materials for advanced packaging applications at this year's DesignCon West The R/flex 3000 family of liquid crystalline polymer (LCP)-based circuit materials includes the R/flex 3600 LCP single-clad laminate and the R/flex 3850 double-clad laminate
This article was originally published on Electronicstalk on 9 Jul 2003 at 8.00am (UK)
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R/flex 3850 laminate is produced in a range of copper and film thicknesses, just as the single-clad laminate, and is available in standard panel formats.
These materials offer a unique combination of mechanical, electrical, thermal, and environmental properties for tightly controlled impedance flex interconnections, next-generation wireless handsets, high-density flip-chip packages and moisture-resistance sensors.
RO4350 Series high frequency circuit material is a glass-reinforced hydrocarbon/ceramic thermoset laminate system designed for performance sensitive, high volume commercial applications.
These laminates are designed to offer superior high frequency performance and low cost circuit fabrication.
The result is a low loss material, which can be fabricated using standard epoxy/glass (FR4) processes.
RO4350 leads the industry in lead-free processing capability and meets the RoHS standards.
RO4450B Series high frequency circuit material is a glass-reinforced hydrocarbon/ceramic thermoset bondply designed for performance-sensitive, multilayer printed circuit boards.
These bondplys are designed to offer superior high frequency performance and low cost circuit fabrication.
The result is a low loss material, which can be fabricated using standard epoxy/glass (FR4) processes.
The new RO4450B-dx is a high fill/flow version of the industry standard RO4450B bondply.
The RO4450B-dx is designed to fill those high-density designs while still offering thin dielectric spacing.
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