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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Rogers Corp
Edited by the Electronicstalk Editorial Team on 27 July 2006

Specialty material products at Chinese
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Rogers Corporation will be showcasing its wide range of specialty material products for use in demanding, high-technology applications at this year's China Hi-Tech Elexcon show in Shenzhen.

Rogers Corporation will be showcasing its wide range of specialty material products for use in demanding, high-technology applications at this year's China Hi-Tech Elexcon show in Shenzhen Featured products for the electronic and handheld markets include

Poron Soft Seal foam, a new formulation of microcellular urethane specifically designed for dust sealing and gap filling within sensitive electronic enclosures.

Enclosures may include high-resolution liquid crystal displays (LCDs) and other user interfaces.

These very soft, PET supported materials may be used in numerous applications in electronic handheld device markets because they maintain product stability and are easy to fabricate.

Poron Soft Seal foams also are able to withstand the effects of compression over the life of the device while managing damaging impact energy to sensitive components.

At a density of 6.5 pounds per cubic foot, they have the lowest density and are the most compressible of all the Poron urethane products.

Available in 1mm thickness (product description SS-06039-90P), Poron Soft Seal foams are the premium choice in dust sealing applications, especially for those that require high conformability along with low closure force.

Bisco Silicones are a full line of cellular, solid and specialty silicone materials produced in roll-stock to be fabricated into gaskets, heat shields, fire stops, seals, cushions and insulation for a wide variety of applications.

These materials are resistant to temperature extremes, UV and ozone and are extremely resilient to mechanical fatigue.

All cellular products carry the most stringent UL fame ratings available.

They are resistant to environmental extremes, and their excellent compression set and safety features make them perfectly suited for critical communications applications.

R/flex Jade Series flexible circuit materials are the next generation of the industry-leading R/flex CRYSTAL epoxy adhesive system.

Environmentally friendly, these materials are halogen-free, lead-free, and flame retardant to meet the environmental requirements without compromising performance in today demanding flexible circuit designs.

The unique adhesive formulation exhibits excellent fill and flow characteristics, eliminating voiding between conductors in low-pressure areas and excelling in multilayer applications.

Applications may include hard disk drives, cellular phones, laptop computers, personal digital assistants, semiconductor packages, and many other uses.

RO4000 Series High Frequency Circuit Material is a glass-reinforced hydrocarbon/ceramic thermoset laminate system designed for performance sensitive, high volume commercial applications.

These laminates and prepregs are designed to offer superior high frequency performance and low cost circuit fabrication.

The result is a low loss material, which can be fabricated using standard epoxy/glass (FR4) processes.

RO3000 Series High Frequency Circuit Material allows design engineers to meet performance criteria at low cost.

These materials combine microwave frequency electrical properties and improved temperature stable performance.

The RO3003 material can be used at high frequencies because of its low dielectric loss.

The low dielectric loss combined with low profile copper foil results in excellent PIM performance.

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