Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Rogers Corp
Edited by the Electronicstalk Editorial
Team on 27 July 2006
Specialty material products at Chinese
show
Rogers Corporation will be showcasing its wide range of specialty material products for use in demanding, high-technology applications at this year's China Hi-Tech Elexcon show in Shenzhen.
Rogers Corporation will be showcasing its wide range of specialty material products for use in demanding, high-technology applications at this year's China Hi-Tech Elexcon show in Shenzhen Featured products for the electronic and handheld markets include
This article was originally published on Electronicstalk on 9 Jul 2003 at 8.00am (UK)
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Silicones and adhesives set for show
Rogers Corp will feature its Bisco EC-2000 Series silicones and EC-2000 conductive adhesive at the upcoming IEEE Conference in Boston.
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Poron Soft Seal foam, a new formulation of microcellular urethane specifically designed for dust sealing and gap filling within sensitive electronic enclosures.
Enclosures may include high-resolution liquid crystal displays (LCDs) and other user interfaces.
These very soft, PET supported materials may be used in numerous applications in electronic handheld device markets because they maintain product stability and are easy to fabricate.
Further reading
Backlights show up at Electronica
Rogers Corp will exhibit its newest electroluminescent (EL) product lines, manufactured by its Durel Division, at this year's Electronica show in Munich.
LCP-based circuit materials show up in Paris
Rogers Corp will be showcasing its R/flex 3000 family of liquid crystalline polymer based circuit materials at this year's RF and Hyper Exhibition in Paris.
PCB material allows denser routing
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Poron Soft Seal foams also are able to withstand the effects of compression over the life of the device while managing damaging impact energy to sensitive components.
At a density of 6.5 pounds per cubic foot, they have the lowest density and are the most compressible of all the Poron urethane products.
Available in 1mm thickness (product description SS-06039-90P), Poron Soft Seal foams are the premium choice in dust sealing applications, especially for those that require high conformability along with low closure force.
Bisco Silicones are a full line of cellular, solid and specialty silicone materials produced in roll-stock to be fabricated into gaskets, heat shields, fire stops, seals, cushions and insulation for a wide variety of applications.
These materials are resistant to temperature extremes, UV and ozone and are extremely resilient to mechanical fatigue.
All cellular products carry the most stringent UL fame ratings available.
They are resistant to environmental extremes, and their excellent compression set and safety features make them perfectly suited for critical communications applications.
R/flex Jade Series flexible circuit materials are the next generation of the industry-leading R/flex CRYSTAL epoxy adhesive system.
Environmentally friendly, these materials are halogen-free, lead-free, and flame retardant to meet the environmental requirements without compromising performance in today demanding flexible circuit designs.
The unique adhesive formulation exhibits excellent fill and flow characteristics, eliminating voiding between conductors in low-pressure areas and excelling in multilayer applications.
Applications may include hard disk drives, cellular phones, laptop computers, personal digital assistants, semiconductor packages, and many other uses.
RO4000 Series High Frequency Circuit Material is a glass-reinforced hydrocarbon/ceramic thermoset laminate system designed for performance sensitive, high volume commercial applications.
These laminates and prepregs are designed to offer superior high frequency performance and low cost circuit fabrication.
The result is a low loss material, which can be fabricated using standard epoxy/glass (FR4) processes.
RO3000 Series High Frequency Circuit Material allows design engineers to meet performance criteria at low cost.
These materials combine microwave frequency electrical properties and improved temperature stable performance.
The RO3003 material can be used at high frequencies because of its low dielectric loss.
The low dielectric loss combined with low profile copper foil results in excellent PIM performance.
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