Product category:
Communications ICs (Wired)
News Release from: Rohm Electronics | Subject: RPM872-H7
Edited by the Electronicstalk Editorial
Team on 03 May 2001
Space-saving optical interface IC
A low-power optical interface IC that combines all the functionality for IrDA-compliant infra-red communications with built-in EMI protection will save space and simplify EMC compliance.
A low-power optical interface IC that combines all of the functionality required for IrDA-compliant infra-red communications with built-in EMI protection will save space and simplify EMC compliance in applications from mobile phones to printers The new RPM872-H7 from Rohm Electronics reduces board space and minimises the need for additional circuit components by incorporating an infra-red LED, a photo diode and all LED driver and receiver circuitry into a single, compact surface mount package
This article was originally published on Electronicstalk on 7 Feb 2001 at 8.00am (UK)
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Ideal for mobile phones, PDAs, mobile instrumentation, printers and other applications requiring infra-red connectivity, the RPM872-H7 is fully compliant with the IrDA 1.2 low-power communication standard and can deliver communication rates of 2.4 to 115.2Kbit/s.
Power dissipation for the device is rated at 100mW, with a built-in power saving function further reducing power consumption during periods of inactivity.
Rohm's RPM872-H7 has dimensions of 8.0 x 2.9 x 2.2mm and will operate from a supply voltage between 2.0 and 3.6V (VLEDA 2.6 to 5.5V).
The RPM872-H7 is particularly suitable for applications where the IrDA communication link is operating at a higher supply voltage than the CPU core.
This interfacing is made possible by the built-in I/O buffer, which has its own supply pin.
Consequently, the device is suitable for applications where the core CPU voltage is as low as 2.0V.
Typical current consumption for the RPM872-H7 is 75uA, falling to just 0.01uA in power save mode.
Operating temperature range is specified at -30 to +85C.
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