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Product category: Light Emitting Diodes (LEDs)
News Release from: Rohm Electronics | Subject: SML-A12 chip LEDs
Edited by the Electronicstalk Editorial Team on 24 April 2003

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Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.

Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity with the minimum PCB footprint and power dissipation Available in red, orange, yellow, green and blue, the new SML-A12 devices will suit a variety of display unit backlighting designs ranging from mobile phones and PDAs to automotive applications and office equipment

Rohm's new SML-A12 low-profile side-emitting package is only 0.55 mm high with a footprint of just 1.6 x 1.15mm.

However, despite its small physical size, relatively large solder terminations should offer a significant improvement in soldering process yield compared to similarly sized alternatives.

The blue LEDs use InGaN on SiC semiconductor technology while the other colours are AlGaInP on GaAs devices.

All are packaged with a reflector with a white diffused epoxy lens.

Typical luminous intensity for the red, orange and yellow devices is rated at 63mcd with forward current of 20mA, and the green device is rated at 40mcd.

The blue LED has typical luminous intensity of 11.5mcd and forward voltage of just 3.0V at forward current of 5mA.

Maximum recommended forward current is 25mA in each case, while peak forward current is rated at 60mA.

The maximum power dissipation of all devices is just 62mW.

Operating temperature for the SML-A12 series is between -30 and +85C, and maximum reverse voltage and current is rated at 4V and 100mA, respectively.

The new LEDs are supplied in tape-and-reel format.

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