Long life for serial EEPROMs

A Rohm Electronics product story
Edited by the Electronicstalk editorial team May 30, 2003

A new family of compact and reliable EEPROM devices will save space and reduce power consumption in high-performance applications where I2C and three-wire serial bus interfaces are required.

Rohm has a new family of compact and reliable EEPROM devices that will save space and reduce power consumption in high-performance applications where I2C and three-wire serial bus interfaces are required.

Available with densities of up to 64Kbit, the new devices include extended temperature versions suitable for industrial and automotive applications.

The new BR24xxxx, BR90xxxx and BR93xxxx EEPROMs are available in a variety of compact space saving packages including DIP8, SOP8, SSOP8 and MSOP8.

Each device will operate from a wide power supply input range of 1.8 to 5V.

Low power consumption is achieved with typical write, read and standby currents of 1.5mA, 0.2mA and 0.1uA, respectively.

Memory densities for the BR24xxxx I2C type EEPROMs range from 1 to 64Kbit.

The BR90xxxx three-wire serial type EEPROMs with direct connection serial port offer densities from 1 to 16Kbit, whereas the standard BR93 three-wire serial memories offer from 1 to 4Kbit.

Temperature range options for the devices are -40 to +85, -40 to +105 and -40 to +125C.

Features for Rohm's EEPROM devices include a self-timed write cycle with automatic erase, a write protect feature, and a write inhibit function at low Vcc.

A double cell structure ensures that all information is stored twice to significantly increase reliability.

Data retention for Rohm's new parts is specified at 40 years and all devices can handle a million rewrite operations.

Filtered inputs are featured in the serial data and serial clock lines on the I2C-bus versions for enhanced noise suppression.

The three-wire versions have fully compatible TTL inputs and outputs.

An SPI version of the new compact EEPROMs is under development and will be launched by Rohm in the future.

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