Product category:
Power Supply ICs and Controllers
News Release from: Rohm Electronics | Subject: TDZ series
Edited by the Electronicstalk Editorial
Team on 04 September 2003
Low-profile Zeners handle more power
A new family of high-reliability Zener diodes offers the industry's lowest profile and allows designers to improving power handling capabilities without sacrificing board space.
A new family of high-reliability Zener diodes from Rohm offers the industry's lowest profile and allows designers to improving power handling capabilities without sacrificing board space Supplied in ultracompact TUMD2 packaging with dimensions of just 1.9 x 1.3 x 0.6mm, devices in Rohm's high-reliability TDZ series offers guaranteed power dissipation ratings as high as 500mW
This article was originally published on Electronicstalk on 29 May 2008 at 8.00am (UK)
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Rohm's new TDZ series comprises 17 diodes with maximum Zener voltage ratings of between 6.8 and 33.0V.
Maximum reverse current for all devices is 10.0uA.
The diodes achieve their high power handling performance as a result of an advanced construction that includes a metal underside for optimum heat dissipation.
The result is a range of devices that occupy the same footprint as an SOD323 package yet offer higher levels of power dissipation.
In addition, the board mounting profile of 0.6mm is 55% lower than existing glass body alternatives, and over 60% smaller than ceramic devices offering similar levels of performance.
Devices in the new TDZ can operate in temperatures of between -55 and +150C and are ideally suited to voltage regulation applications in designs where board space and height is at a premium.
The diodes are constructed with a rectangular plastic body that is designed for full compatibility with modern automatic production.
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