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    <description>Royce Instruments news releases on Electronicstalk</description>
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    <copyright>Copyright (C)2008 Pro-Talk Ltd. All rights reserved.</copyright>
    <pubDate>Sat, 22 Nov 2008 08:00:00 UT</pubDate>
    <lastBuildDate>Sat, 22 Nov 2008 08:00:00 UT</lastBuildDate>
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      <title>Universal bond tester offers compact reliability</title>
      <description>All interchangeable test modules in the System 650 range can be range selected over a broad scale, permitting measured force resolution of less than 1mg.</description>
      <pubDate>Fri, 14 Sep 2007 08:00:00 UT</pubDate>
      <category>Royce Instruments</category>
      <link>http://www.electronicstalk.com/news/ror/ror101.html</link>
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      <title>Die handling system cuts production bottleneck</title>
      <description>A novel fully automated handling system picks die from diced 300mm wafers and transfers them to die carriers, such as waffle packs, GelPaks etc.</description>
      <pubDate>Mon, 25 Jul 2005 08:00:00 UT</pubDate>
      <category>Royce Instruments</category>
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