Product category:
Stand-Alone Instruments
News Release from: Royce Instruments | Subject: System 650 universal bond tester
Edited by the Electronicstalk Editorial
Team on 14 September 2007
Universal bond tester offers compact
reliability
All interchangeable test modules in the System 650 range can be range selected over a broad scale, permitting measured force resolution of less than 1mg.
Royce Instruments has released the System 650 universal bond tester It satisfies the demand for a dependable, compact test system with generous expandability to support advanced packaging requirements
This article was originally published on Electronicstalk on 25 Jul 2005 at 8.00am (UK)
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The System 650's quick start test modules permit rapid changeover between wire pull, tweezer pull, ball bond shear, cold ball pull or die shear tests.
All interchangeable test modules can be range selected over a broad scale, permitting measured force resolution of less than 1mg.
Calibration accuracy between different machines is maintained within overall system accuracy of 0.15%.
The System 650 conforms to SEMI S2 ergonomic standards, with comfortable joystick controls and "one touch" motorised constant focus microscope height adjustment.
To minimise clean room bench space, the PC is integrated into the system.
By eliminating the typical "no name" floor-mounted PC with its dangling cables and connectors, the System 650 retains the advantages of a single source vendor and an industry standard PC architecture.
The high- resolution motion control system is precise enough to repeatably deliver less than 1 micron bond shear heights, yet is robust enough to shear large die up to 200kgf.
A 305 x 155mm servo-driven XY stage permits testing of 300mm wafers, leadframes, large substrates or PC boards.
Running under Windows XP, the Bond Test Manager control program supports Asian and European languages and offers rich statistical reporting and analysis, with support for corporate databases.
The user environment can be controlled by several levels of permissions.
The overall system footprint is 560 x 432 x 585mm.
The system 650 complies with a wide range of industry standards including Mil Std 883, ASTM F 1269, EIAJ ET-7407, JESD22-B117, JESD22-116 CE and is ROHS WEEE-compliant.
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