Product category:
Heatsinks and Thermal Management
News Release from: Rapid Electronics | Subject: Bergquist thermal management products
Edited by the Electronicstalk Editorial
Team on 04 April 2008
Thermal interface materials available
from stock
All Bergquist products available from Rapid electronics provide exceptional levels of performance and thermal conductivity.
Rapid Electronics has expanded its stock of Bergquist thermal management products to include a new range of high performance insulators, adhesives, gap filling and interface materials With over 40 years of experience, Bergquist leads the market in products that manage heat in electronic circuits, particularly around semiconductors
This article was originally published on Electronicstalk on 8 Jul 2004 at 8.00am (UK)
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Whether at the design stage or at full production, thermal interface materials are required for heat reduction and insulation purposes, to eliminate airgaps between heatsinks and bare-leaded high-voltage devices and to act as electric isolators.
Superior thermal performance and electrical isolation is essential in a wide variety of applications, including power supplies, automotive electronics, telecommunications and motor controls.
Rapid now offers 37 new Bergquist product lines at excellent prices.
All Bergquist products provide exceptional levels of performance and thermal conductivity, ranging from the Sil-Pad - a reinforced gap-filling material providing extremely effective heat protection - to Hi-Flow, a phase-change material designed to replace grease as a thermal interface.
Also available from April 2008 are new introductions in the Gap Pad and Bond-Ply ranges.
With surprisingly competitive prices, ex-stock availability and no minimum order value, Rapid offers customers an impressive choice of Bergquist thermal management products. Request a free brochure from Rapid Electronics ...
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